Jörg Ludewig
  • Academic studies of communication engineering at the institute of electrical and mechanical precision toolmaking of Technical University Dresden
  • Participation and later managing function at the ‘Arbeitsstelle für Molekurlarelektronik Dresden’ (AMD), construction of modules for equipements and devices for production of semiconductor devices development of basic processes for semiconductor chip assembly in metal packages as well as development of processes for chip assembly in ceramic packages
  • Division manager of ‘Cycle II’ (semiconductor assembly, research, development and production) at the microelectronic center of research and technology (ZFTM) in Dresden
  • Founder, managing director and shareholder of Microelectronic Packaging Dresden GmbH as service provider for advanced packaging of integrated circuits, sensors and microsystems
  • Inventor and co-inventor of patents on construction and connection technology
Dr. Rainer Schweer
Advisor Product Management
  • Mathematis graduate
  • Work on the research and development of integrated switched capacitor circuits assembled in CMOS technology at the University of Dortmund
  • Employed at ITT Intermetall (today Micronas)
  • Managerial positions in various international development departments of the Thomson Group
  • Author and co-author of international scientific publications, inventor and co-inventor of numerous patents
How to contact us
viimagic GmbH
Phone +49 (0)351 888 121-87
Fax     +49 (0)351 888 121-89