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Roland Mielke
CEO
  • Academic studies of industrial engineering at the University of Technology and economy in Mittweida (FH)
  • Leading activities in controlling respectively commercial manager of various producing industrial enterprises (Margon Brunnen GmbH, UKM Meißen GmbH, Tapetenfabrik Coswig GmbH, Sunicon AG Freiberg)
  • Commercial manager leading into the position of CEO at Microelectronic Packaging Dresden GmbH later on
  • Commercial manager and from July 2017 onwards CEO of viimagic GmbH
Gregor Woldt
Expert in development on construction and connection technology
  • Academic studies of Physics and Electronic components at the University of Technology in Karl-Marx-Stadt (today TU Chemnitz)
  • Assistant at the Institute of Micro Elektronic Dresden (IMD), development of processes for chip assembly in ceramic packages
  • Department manager of ‘Cycle II’ (semiconductor assembly, research, development and production) at the microelectronic center of research and technology (ZFTM) in Dresden
  • Head of development Microelectronic Packaging Dresden GmbH as service provider for advanced packaging of integrated circuits, sensors and microsystems
  • Inventor and co-inventor of patents on committee
  • Participation on joint research projects of BMBF and Saxony
  • Activities as an Industry Advisor and Assessor
Werner Schneider
Expert in development on construction and connection technology / materials sience
  • Academic studies in Materials Sience at the Bergakademie Freiberg
  • Participant at the Institute of Micro Elektronic Dresden (IMD), as well as of the follow up companies Center for Reasearch and Technology in Micro Electronic (ZFTM) and Center for Micro Electronic Dresden (ZMD) with the focus on development of materials for the assembly of integarted circuits as well as the substitution of the material gold in the construction and connection technology
  • Responsible for materials at the Microelectronic Packaging Dresden GmbH (MPD)
  • Developer for innovative industrial solutions in construction and connection technologies of semiconductor components and sensors
  • Inventor and co-inventor of patents on construction and connection technology
  • Participation on joint research projects of BMBF and Saxony
  • Participation on national committees on materials for construction and connection technology
Jörg Ludewig
Scientific adviser
  • Academic studies of communication engineering at the institute of electrical and mechanical precision toolmaking of Technical University Dresden
  • Participation and later managing function at the ‘Arbeitsstelle für Molekurlarelektronik Dresden’ (AMD), construction of modules for equipements and devices for production of semiconductor devices development of basic processes for semiconductor chip assembly in metal packages as well as development of processes for chip assembly in ceramic packages
  • Division manager of ‘Cycle II’ (semiconductor assembly, research, development and production) at the microelectronic center of research and technology (ZFTM) in Dresden
  • Founder, managing director and shareholder of Microelectronic Packaging Dresden GmbH as service provider for advanced packaging of integrated circuits, sensors and microsystems
  • Inventor and co-inventor of patents on construction and connection technology
Dr. Rainer Schweer
Technical adviser Image sensor development
  • Mathematis graduate
  • Work on the research and development of integrated switched capacitor circuits assembled in CMOS technology at the University of Dortmund
  • Employed at ITT Intermetall (today Micronas)
  • Managerial positions in various international development departments of the Thomson Group
  • Author and co-author of international scientific publications, inventor and co-inventor of numerous patents
How to contact us
viimagic GmbH
Phone +49 (0)351 888 121-87
Fax     +49 (0)351 888 121-89