Funding project “Opto AVT”

Packaging and interconnection technology for optical sensors for use in autonomous driving and industry 4.0

Project goal: Research/development of a new chip-on-board (COB) concept for large image sensors based on laminate substrates in a smaller package. With this new technology, cover glasses are to be directly mounted over the sensor area on the sensor chip using wafer-level bonding technologies. A special 3D printing technology is being developed for covering the wire bridges.

Project duration from 01.06.2019 to 31.05.2021


  • First Sensor Microelectronic Packaging GmbH (FSP)
    Technology and assembly development for LiDAR sensors
  • MSG Lithoglas GmbH (Lithoglas)
    Technology development glass cover in wafer level
  • Technische Universität Dresden (TUD)
    Technology development of a selective 3D-covering of the structure



Funded by EFRE

Funded by EFRE

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viimagic GmbH
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