Funding project “Opto AVT”
Packaging and interconnection technology for optical sensors for use in autonomous driving and industry 4.0
Project goal: Research/development of a new chip-on-board (COB) concept for large image sensors based on laminate substrates in a smaller package. With this new technology, cover glasses are to be directly mounted over the sensor area on the sensor chip using wafer-level bonding technologies. A special 3D printing technology is being developed for covering the wire bridges.
Project duration from 01.06.2019 to 31.05.2021
Projektpartner:
- First Sensor Microelectronic Packaging GmbH (FSP)
Technology and assembly development for LiDAR sensors - MSG Lithoglas GmbH (Lithoglas)
Technology development glass cover in wafer level - Technische Universität Dresden (TUD)
Technology development of a selective 3D-covering of the structure
Funded by EFRE
Funded by EFRE
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